Hwatsing has been deeply involved in the field of wafer reclaim processing for many years, with a professional and experienced research and production team. It is the first domestic enterprise to achieve successful mass production of 12" reclaim wafer.
Based on independently developed CMP equipment, Hwasting has accumulated core technologies for reclaimed wafer processing through mature CMP techniques. It has established advance FAB factory Cu/NonCu physically isolated wafer reclaim process flow, achieving contamination-free, low-defect, high-planarity, and high-cleanliness wafer reclaim. With a single remove thickness below 5μm, the solution significantly reduces costs for customers.
Hwatsing possesses in-house developed mass-production equipment and world-leading surface defect inspection tools, supported by a comprehensive MES for inline production process control. We provide customers with higher cost-performance and more secure & agile wafer reclaim foundry services, with our industry-leading 26nm particle control technology.
