The Universal-150 Smart is a mature 6-inch CMP device developed according to the current market requirements. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, compatible with 6/8 inch wafer, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has the advantages of flexible process matching and high yield, to meet the needs of mature process technology, widely used in the third generation semiconductor, MEMS and other manufacturing processes.
Multi-section polishing head
Compatible with 6/8-inch wafer
Flexible process matching and high output rate
Satisfy mature process technology requirements