The Universal-300 E is a mature 12-inch CMP device developed for the mid-to-high end market. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, integrated with a variety of advanced endpoint detection technology. The device has excellent process stability and high production efficiency, can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
CMP platform for 12inch wafer planarization
Mature Structure with stable performance
High cost effective
Meet the technology requirements of mature process