Universal-200 D is a mature 8-inch CMP device developed on the basis of innovative technology with independent intellectual property rights of Hwatsing. The equipment is equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, applicable to a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in manufacturing processes such as silicon wafers, third-generation semiconductors, MEMS, Micro LED, etc.
Multi-section polishing head
Dry-in and dry-out
Satisfy mature process technology requirements