Master-BN300 is a 12-inch wafer bevel precision polishing equipment developed based on cutting-edge industry requirements. This device integrates high-precision polishing, efficient cleaning, and precise measurement functions, adopts modular design, and is compatible with the needs of various processes and application fields. It can significantly improve the smoothness of wafer bevel, meet the technical requirements for high-precision bevel processing in the semiconductor manufacturing field, and has been applied in key processes such as storage chips and advanced packaging.
Modular design matches the bevel polishing needs of different fields
Higher polishing efficiency and surface smoothness
Effectively improve wafer bevel cleanliness and product yield
High precision measurement system for online detection and evaluation of polishing effect