HSC-F2400 is applied to final cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.
Equipped with automatic compatibility of 4/6/8-inch wafer cleaning
Capable of Dry-in/Dry-out or Wet-in/Dry-out function
Better wafer process clamping mode
Equipped with double-sided brushing and double-sided single cleaning function, more efficient and convenient
Flexible configuration, better cleaning effect